Amtest - no. 1 SMT distributor in Central and Eastern Europe

Latest news

  • 30/04/2020

    Welcome to the team

    We are proud to announce our newest team members Barnabás Szalai and Csaba Szabó. See more details

  • 28/02/2020

    Nano Dimension the world leading 3D-printing electronics company have teamed up with Amtest Group

    Nano Dimension the world leading 3D-printing electronics company have teamed up with Amtest Group in the countries of Romania, Hungary, Poland, Slovenia, Serbia, Croatia and Bulgaria. See more details

  • 16/01/2020

    Amtest Group and X-Treme Series sign exclusive distribution agreement

    Amtest Group and X-Treme Series sign exclusive distribution agreement covering Romania, Hungary, Poland, Slovenia, Serbia, Croatia and Bulgaria. See more details

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Wire Bonding

F+K Delvotec

German leader in the wire bonding process.

Specialists for assembly and joining technologies who are committed to continuing to develop reliable and efficient products and solutions for connecting electronic components since they were founded in 1978.

In the field of wire bonding for customers in the semiconductor, E-Mobility, Photo-Voltaic and automotive industries F&K Delvotec developed complete solutions for partial or full automation. The all-round service ranges from applications guidance in the selection and configuration of the wire bonding machines through to coupling of buffer stations and magazines as well as the integration of feeding systems.

Wire Bonder G5 Single – the first and only fully automatic all-in-one bonder in the world

The compact, space saving Wire Bonder G5 is a veritable multi-talent. It can be converted to any current wire bond process in a very short time.



Wire Bonder G5-2 – the first and only wire bonder with two heads on a single chassis

Wire Bonder G5-XL – the first wire bonder with a working area of almost one square metre

Laser Bonder – Raising the curtain on a completely new technology


With the world premier of their laser bonder in 2015, F&K Delvotec GmbH underlined once again the validity of its motto: Staying ahead in Bonding Technology.

The completely new process, based on laser micro-welding, is particularly suitable for joining ribbon as well as bonding wire onto battery terminals and onto DCB substrates and copper terminals in power electronics modules. With laser bonding the application of ribbon bonding for much higher currents is accomplished.