Amtest - no. 1 SMT distributor in Central and Eastern Europe

Latest news

  • 05/06/2017

    Nordson Technology Day

    June 13th – 14th Nordson Asymtek will be hosting their technology days in the Netherlands. See more details

  • 07/03/2017

    Amtest Group – VI Technology Open Day Success

    More than 20 customers attended the event at the AMTEST Open Day at the AMTEST HQ , including top EMS and automotive companies, for live demos of the 5K3D and PI machines. See more details

  • 16/02/2017

    The Group would like to thank Frigyes Marton for his 10 year service

    Originally joining us as a maintenance engineer working on Samsung machines - he then moved to the field engineer team. See more details

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Wire Bonding

F+K Delvotec

German leader in the wire bonding process.

Specialists for assembly and joining technologies who are committed to continuing to develop reliable and efficient products and solutions for connecting electronic components since they were founded in 1978.

In the field of wire bonding for customers in the semiconductor, E-Mobility, Photo-Voltaic and automotive industries F&K Delvotec developed complete solutions for partial or full automation. The all-round service ranges from applications guidance in the selection and configuration of the wire bonding machines through to coupling of buffer stations and magazines as well as the integration of feeding systems.

Wire Bonder G5 Single – the first and only fully automatic all-in-one bonder in the world

The compact, space saving Wire Bonder G5 is a veritable multi-talent. It can be converted to any current wire bond process in a very short time.



Wire Bonder G5-2 – the first and only wire bonder with two heads on a single chassis

Wire Bonder G5-XL – the first wire bonder with a working area of almost one square metre

Laser Bonder – Raising the curtain on a completely new technology


With the world premier of their laser bonder in 2015, F&K Delvotec GmbH underlined once again the validity of its motto: Staying ahead in Bonding Technology.

The completely new process, based on laser micro-welding, is particularly suitable for joining ribbon as well as bonding wire onto battery terminals and onto DCB substrates and copper terminals in power electronics modules. With laser bonding the application of ribbon bonding for much higher currents is accomplished.