| |
ABOUT KESTER
Kester Solder was founded in USA in 1899 under its original name, the Chicago Solder Company.
The company was formed to produce flux-cored solder, based on the unique, patented by Kester manufacturing process, still used until today. The official name changed to Kester Solder in 1929.
To serve the European market, Kester opened manufacturing facility in Germany in 1972.
Kester is a leading worldwide manufacturer and supplier of solders and related materials for the electronics manufacturing industry. The range of products offered includes: solder pastes, liquid fluxes, flux cored wire solder, solder preforms, solder bars, tacky soldering fluxes and advanced polymer products.
Kester products and services are used by wide range of industries such as telecommunications, computers, automotive, military, component manufacturing and consumer electronics.
Kester's QS-9000, ISO-9001 and ISO 14001 certifications ensure their partners of the dedication to quality and environmental responsibility.
LEAD-FREE SOLDERING
The European electronics assembly industry is moving fast towards the implementation of Lead-free solders. More and more Lead-free boards are assembled using a full Lead-free process. The present motivation of the industry to go Lead-free is driven by the market itself. A second drive is not to be left behind the Japanese assembly industry which already is using Lead-free solders in big volumes.
Kester is a leader in the development and manufacture of solders and related materials, specifically designed for the new demands of the lead free technology.
KESTER HIGHLIGHTED LEAD FREE PRODUCT
 EM918 Lead Free, No-Clean Solder Paste
EnviroMark918 is a lead-free, air and nitrogen reflowable, no-clean solder paste specifically designed for the thermal requirements of lead free alloys, including the Sn96.5Ag3.0Cu0.5 alloy. The paste flux system allows joint appearances that closely resemble that achieved with SnPb alloys. EM918 is capable of stencil printing downtimes up to 60 minutes with an effective first print down to 20 mils without any kneading. EM918 also exhibits excellent continual printability for fine pitch (0.4mm/16 mils) and is able to print at high speeds up to 150 mm/s (6"/s). This solder paste also exceeds the reliability standards required by J-STD-004.
SUPPORT
The engineers from Kester and Amtest are at your disposal for tests with Kester materials in your production, optimization of your reflow and wave soldering processes as well as to share our experience. Analyses of samples from solder pots to define impurities can be organized for customers using Kester solder bar.
| Technical data sheets for the most often used solder pastes: |
|
 |
EM918 (lead-free, no-clean) |
|
|
EM907 (lead-free, no-clean) |
|
|
EM909 (lead-free, no-clean, compatible for In Circuit Testing) |
|
|
EM808 (lead free, water soluble) |
|
|
R276 (no-clean, lead-free or SnPb, for dispensing applications) |
|
|
EP256 (lead based, no-clean) |
|
|
PM202 (lead based, no-clean) |
|
|
HM531 (lead based, water soluble) |
|
|
FL250D (lead based, no-clean) |
|
|
| Technical data sheets for the most often used liquid fluxes: |
|
|
979 (VOC-free, no-clean, typically used for spray applications) |
|
|
971 (water based, no-clean, typically used for foam applications) |
|
|
959T (alcohol based, no-clean, halide free, for spray and foam applications) |
|
|
950E (alcohol based, no-clean, halide free, 2% solids content, for spray and foam applications on machines with single wave) |
|
|
| Technical data sheets for the most often used solder wires: |
|
|
245 (no-clean, low residue, typically for SnPb) |
|
|
275 (no-clean, low residue, lead-free) |
|
|
331 (water soluble, organic, lead-free and SnPb) |
|
|
| Technical data sheets for tacky soldering fluxes: |
|
|
TSF6592 (no-clean, typically for lead-free applications) |
|
|
TSF6850 (water soluble, typically for lead-free applications) |
|
|
TSF6516 (no-clean, typically for SnPb applications) |
|
|
|
|
