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Go Selective

The GoSelective offers all in one: highest flexibility, absolutely reproducible results, high soldering quality even with demanding assemblies, low capital expenditure and the possibility to be upgraded step by step at a later date to suit subsequent production developments.

Flexibility is also given in the handling of the assemblies. Both, bare boards as well as assemblies in carriers can be processed with all GoSelective systems.

A highly precise portal axis system is the "heart" of the GoSelective machines. The axis with servo-drive ensure a reliable positioning of the assemblies and work with a repeatability of ± 0.1 mm.

The gripper unit is provided with a pneumatic rotating function and may be tilted to obtain an ideal solder angle. This ensures an exactly defined peel-off of the solder flow, Thus, highest soldering quality is guaranteed. Even fine pitch components can be soldered with a minimized risk of bridging.

To meet subsequent throughput requirements in your production, the GoSelective inline versions may be extended with separate fluxer and / or preheat modules which will be installed in front of the machine. This reduces the cycle time remarkably.

	Your advantages at a Glance
	Precise portal axis system with maximum flexibility
	Solder waves with touch-less wave height control for highest reliability
	Local nitrogen inertion of the solder waves for best possible soldering results
	Modular construction allows the system to grow, to minimize cycle times
	The rotating and tilting function of the gripper allows ideal peel-off
	Short product change-over
	Easy to handle teaching function
	Offline Teach Program for maximum machine availability
	GoSelective-1-RT for stand-alone operation with manual loading and unloading of the assemblies
	GoSelective-1-Inline designed for integration into a fully automated production line
	GoSelective-2 designed for inline operation with short cycle times and with up to two soldering units
	250 mm metal blade squeegee

Selective Soldering System
MWM 3250

MWM 3250

The MWM 3250 is a modular selective soldering system which may be totally tailored to meet your production requirements. At a later date it may even be upgraded to suit subsequent production developments.

The MWM 3250 is suitable to meet all requirements: productions with a high mix of assemblies typically use the miniwave soldering process.

High volume productions with only low board mix prefer a dip soldering process with product specific multi nozzle tools to shorten cycle times.

If frequently changing products are manufactured in high production volumes, the MWM 3250 may be equipped with various soldering units to cover different soldering processes with only one machine system.

Also conventional wave soldering processes may be performed this way.

With its positioning accuracy of 0.05 mm, the gripper guidance unit offers a maximum precision. Depending upon requirement different grippers for the processing of carriers or PCBs directly may be used.

The state-of-the-art solder nozzle technology effects the highest degree of precision. The solder nozzles perform a defined flow direction. These non-wettiable, of course lead-free capable solder nozzles therefore show a reproducible flow behaviour and thus guarantee consistently good soldering results. With minimum maintenance requirements, these soldering nozzles are featured with a very high ifetime.

	Your advantages at a Glance
	High precision SCARA robot
	Maximum flexibility with different working stations which may be arranged in the process area according to your requirements
	Short product change-over times
	Gripper with directional functions for non-planar PCBs
	State-of-the-art solder nozzle technology
	Permanent wave height control
	Easy and quick online programming
	Comfortable offline teach program for maximum machine availability

HSS 3235

The HSS 3235 is ideal, as a supplement to reflow processes, to solder leaded components or connectors. This applies specifically when short cycle times are required for large volume production.

Both, bare boards as well as carriers can be processed and of course the HSS 3235 may be integrated into a fully automated production line.

Depending on the size of PCB to be soldered, the HSS 3235 feeds one or more assemblies into the different machine areas: fluxer, preheating or soldering area. In each case, all joints will be fluxed, preheated or soldered in parallel and at the same time which guarantees shortest cycle times.

Either a stamp fluxing system or a coordinate spray fluxer may be integrated into the HSS 3235. In the soldering area the HSS 3235 uses the dip soldering process with high precision solder nozzle arrangements which of course are quickly exchangeable. The soldering area incorporates a number of technical innovations, which contribute to excellent wetting, perfect peel-off even at fine pitch connectors and reliable filling of through-holes.

	Your advantages at a Glance
	Simultaneous processing assures short cycle times
	Flexible system concept
	High process reliability
	Closed loop wave height control
	Quickly exchangeable product-specific nozzle toos in the fluxing and soldering area
	Bare board handling or processing of carriers
	Ideally suited for high volume inline processes

Semi-Automatic Selective Soldering System
RTH 3700

RTH 3700

In many electronic production lines, the selective soldering process is an integrated and unavoidable part that usually is required to perform at an extraordinary level of flexibility as to the different products manufactured. This requirement, however, makes the system expensive and rather complicated to use.

SEHO's selective soldering system RTH 3700 provides fully automated process steps for all quality related procedures. Yet those steps that are performed most easily by an operator are manual.

Although the RTH 3700 is meant and configured to perform selective dip soldering operations, it can easily be converted to carry out tinning of component leads and terminations, of coils and of wire cups.

All this results in a very flexible unit with a wide range of applications operating at a high quality level with low capital expenditure: RTH 3700.

	Your advantages at a Glance
	High productivity because of short cycle times
	High soldering quality because of automated production processes
	Wide range of applications
	Individually configurable work stations
	Easy operation with clear control panel
	Ideally suited for selective dip soldering processes

Selective Soldering System
GoLaser

GoLaser

With the GoLaser, SEHO provides a selective laser soldering system which not only offers highest precision in selective soldering. Moreover, this system is nearly maintenance-free and a very attractive solution for small budgets.

The GoLaser from SEHO offers special advantages when processing temperature-sensitive materials or in case of very small component structures. Both applications would not be suited for miniwave or reflow soldering, but perfectly can be soldered with the GoLaser. With its thoroughly considered concept, the GoLaser offers a wide field of application and ensures highest production quality.

The SEHO GoLaser may either be used stand-alone or may be integrated into a fully automated production line. It is designed for soldering of THT components from the PCB bottom side.
The power controlled diode laser with closed-loop temperature and solder volume control guarantees an absolutely reproducible process and highest precision.

The SEHO GoLaser is equipped with a vision system for automatic alignment of the assemblies to be processed. CAD data can simply be downloaded and a comprehensive library of components ensure easy programming and operation of the system. This significantly reduces the programming time and costs.

	Your advantages at a Glance
	High-performance diode laser ensures short cycle times
	High process reliability
	Closed loop temperature control
	Absolutely reproducible process
	Easy programming and operation
	Extremely low maintenance and operation costs
	Stand-alone or inline operation
	Ideally suited for high mix – low volume production